Eric Boles : Semiconductor Equipment — Eric Boles

Eric Boles

Senior Industrial Designer — product strategy, form development, and user-centered design.

Industrial Design for Semiconductor Manufacturing Equipment

Senior Industrial Designer
InDepth Design | 2002–2013

Industrial Design • Rhino • Prototyping • DFM • Engineering Collaboration

Overview

For more than a decade, I designed industrial enclosures and equipment for semiconductor manufacturing systems, collaborating with engineers and clients to transform complex technical requirements into manufacturable, serviceable, and visually refined products. While much of this work was proprietary and is no longer publicly documented, it represents the foundation of my experience in industrial design.

 

The Challenge

Semiconductor manufacturing equipment presents unique industrial design challenges. Systems often contain densely packaged mechanical, electrical, pneumatic, and electronic components while requiring easy service access, structural rigidity, manufacturability, and a professional appearance suitable for high-tech manufacturing environments.

Each project required balancing engineering constraints with user needs, manufacturing processes, maintenance requirements, and visual consistency.

 

My Role

· Developed exterior forms and enclosure designs for complex industrial equipment.

· Created concept sketches, Rhino CAD models, and presentation renderings.

· Developed innovative solutions to several challenges with each project to satisfy the clients’ goals.

· Designed sheet-metal and plastic enclosure systems that integrated with engineering requirements.

· Collaborated closely with engineers to refine designs for manufacturing and assembly.

· Built and modified physical prototypes to evaluate fit, function, and appearance.

· Produced production-ready CAD data and design documentation.

 

Design Considerations

· Creating clean, professional forms around complex internal assemblies.

· Designing removable panels for maintenance and service access.

· Building structural enclosures with minimal footprints and maximum access areas, that can support over 25,000 pounds of lead shielding.

· Integrating cooling, cable routing, and component locations into the enclosure design.

· Balancing aesthetics with manufacturing constraints and cost.

· Ensuring consistency across product families while accommodating different system configurations.

 

Results

Contributed to the successful development of multiple semiconductor manufacturing systems over an 11-year period, supporting projects from concept through engineering collaboration and production. While many of these products remain proprietary or have since been replaced by newer generations, the experience developed a deep understanding of designing complex products for real-world manufacturing environments.

 

 

 

Key Design Decisions

This is where your experience becomes obvious.

For example:

· Why you chose certain panel breaks.

· How you balanced aesthetics with serviceability.

· How manufacturing influenced the design.

· Why operators needed access to certain components.

 

 

Lessons Learned

Two or three sentences.

Semiconductor Equipment LensAR Utomic EDGE Packaging Systems Prototype Development

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